Flexible Packages: Characteristics and Converting Process

Study of ACF Bonding Technology in Flexible Display Module Packages

Anisotropic conductive film (ACF) has been used for more than 30 years in flat panel display (FPD) module package. In this paper, the technical trends and development of ACF are described. Among all of them, ACF material design for flexible substrate bonding is critical for the development of flexible display. According to different process flow of flexible AMOLED, flexible substrate bonding te...

Converting unstructured into semi-structured process models

Business process models capture process requirements that are typically expressed in unstructured, directed graphs that specify parallelism. However, modeling guidelines or requirements from execution engines may require that processes models are structured in blocks. The goal of this paper is to define an automated method to convert an unstructured process model containing parallelism into an ...

An Extended Network Model with a Packages Diffusion Process

The dynamics of a packages diffusion process within a selforganized network is analytically studied by means of an extended f-spin facilitated kinetic Ising model (Fredrickson-Andersen model) using a Fock-space representation for the master equation. To map the three component system (active, passive and packages cells) onto a lattice we apply two types of second quantized operators. The active...

Scalable and Flexible Multivariate Process Monitoring Solution

Process Analysis and Flexible Transfer Line Configuration

The offer of the best machine tool configuration for the specific customer’s need is a decisive factor to compete in the machine tool sector. Actually the offer is organized by the manufacturer mostly on the basis of his own experience and requires a considerable amount of time and money. This effort does not always lead to tangible results, since few offers actually lead to purchases. So there...